Product Details
Potting Compound with 100 pbw ER130 and 16 pbw TEK113B Mixing Ratio in 1Kg Tin
Overview
Medium viscosity epoxy casting resin system for encapsulation of electrical and electronic equipment. Tek113B provides good gloss finish and medium reactivity. Standard hardener for electronic potting.
Features
Resin Fr476
Specification
- Colour: Brown
- Mixing Ratio
- ER130 : 100 pbw
- TEK113B : 16 pbw
- Density
- ER130: 1.60
- Tek113B: 0.95
- Viscosity
- ER130 : 30000 to 60000 mPa.s at 25°C
- TEK113B : 300 to 500 mPa.s at 25°C
- Pot Life: 30 to 40 minutes at 25°C
- Gelation Time: 2 to 2 1/2 Hours at 25°C (Test tube Gelnorm DIN 16945)
- Curing Time : 4 to 5 hours at 25°C (500 Grams)
Characteristics After Cure
- Hardness : 75 Shore D after 3 days at 25°C
- Dielectric Strength : 1.3 KV/mm (Approx.)
- Heat Distortion Temperature : 60°C
- Continuous Temp. of Operation : 70°C (25000 h weight loss)